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Chip Scale Packaging
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hardware (CSP) Surface Mount International attendees debated
chip scale technologies as system manufacturers seek new
levels of package miniaturisation for chip-on-board, flip chip
and multichip modules. Technical and marketing gurus
furthered the technical debate by focussing on which chip
scale packaging schemes would be the most cost-effective for
future packages designated for high volume consumer
applications. Bare chip package supporters noted that
mainstream circuitry is readily available in known good die
(KGD) from a number of suppliers. Traditional ball grid array
packages received strong support for current high volume and
high density manufacturing needs. Chip scale packages (CSP)
provide pre-speed-sorted,pre-tested and pre-packaged die
without requiring specialized testing. CSP supporters improved
their position with ChipScale's announcement that Motorola
will license its Micro SMT packaging technology.